TIF100-32-05U Ultra Soft Thermal Silicone Pad 3.2W High Conductivity Gap Filler For AI Servers, GPU Cooling, Inverter
The TIF®100-32-05U Series is an ultra soft thermal interface material designed specifically to protect precision components that are extremely sensitive to mechanical stress. This product combines high thermal conductivity with extreme gel grade flexibility to achieve a perfect fit with low stress.It is suitable for solving problems such as large tolerances,uneven surfaces, and susceptibility of precision components to mechanical damage in high-precision assemblies.
Features:
> Good thermal conductivity: 3.2W/mK
> Ultra soft and highly compliant
> Self-adhesive without the need for additional surface adhesives
> Good insulation performance
> Easy release construction
> Electrically isolating
> High durability
Applications
> AI Servers, Inverters, Telecom Devices
> Power tools
> Network communication products
> Electric vehicle batteries Computer CPU/GPU Cooling
> New energy vehicle power systems
> Monitoring the Power Box
> AD-DC Power Adapters
> Rainproof LED Power
> Waterproof LED Power
| Typical Properties of TIF®100-32-05U Series |
| Property | Value | Test method |
| Color | Blue | Visual |
| Construction & Compostion | Ceramic filled silicone elastomer | ****** |
| Density(g/cm³) | 3.0 | ASTM D792 |
| Thickness Range(inch/mm) | 0.010~0.020 (0.25~0.50) | 0.030~0.200 (0.75~5.0) | ASTM D374 |
| Hardness | 65 Shore 00 | 27 Shore 00 | ASTM 2240 |
| Recommended Operating Temperature | -40 to 200℃ | *** |
| Breakdown Voltage(V/mm) | ≥5500 | ASTM D149 |
| Dielectric Constant | 3.5 MHz | ASTM D150 |
| Volume Resistivity | ＞1.0X1012 Ohm-meter | ASTM D257 |
| Flame rating | V-0 | UL 94 (E331100) |
| Thermal conductivity | 3.2 W/m-K | ASTM D5470 |
| 3.2 W/m-K | ISO22007 |
Product Specifications
Standard Thickness: 0.010"(0.250 mm)-0.20" (5.00 mm) with increments of 0.01 inch (0.25 mm).
Standard Size: 16"×16" (406 mm ×406 mm)
Component Codes:
Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment),
DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).
The TIF® series is available in custom shapes and various forms.
For other thicknesses or more information, please contact us.
Packaging Details & Lead time
The packaging of thermal pad
1.with PET film or foam-for protection
2. use Paper Card To Separate Each Layer
3. export carton inside and outside
4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000
Est. Time(days): To be negotiated
Company Profile
Ziitek company is a manufacturer of thermal conductive gap fillers, low melting point thermal interface materials, thermal conductive insulators, thermally conductive tapes, electrically & thermally conductive Interface pads and thermal grease,Thermal Conductive plastic,Silicone Rubber,Silicone Foams,Phase Changing Materials products, with well-equipped testing equipment and strong technical force.
Certifications:
ISO9001:2015
ISO14001: 2004 IATF16949:2016
IECQ QC 080000:2017
UL
Independent R&D team
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TIF100-32-05U Ultra Soft Thermal Silicone Pad 3.2W High Conductivity Gap Filler For AI Servers, GPU Cooling, Inverter Images
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